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US Patent D984397 Circuit board

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Yidong Cai0

Date of Patent

April 25, 2023

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Patent Application Number

297742870

Date Filed

March 16, 2021

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Patent Citations

US Patent 11508646 Semiconductor device

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US Patent 10980131 Chip embedded printed circuit boards and methods of fabrication

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US Patent 10015882 Modular semiconductor package

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US Patent 10271448 Thin leadframe QFN package design of RF front-ends for mobile wireless communication

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US Patent 10375816 Printed-circuit board, printed-wiring board, and electronic apparatus

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Patent Citations Received

US Patent D1012050 Computer

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Patent Primary Examiner

Leanne Was-Englehart

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CPC Code

0

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