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US Patent RE45403 Laser processing method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 6, 2014
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Date of Patent
March 3, 2015
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Patent Application Number
14148180
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Patent Citations Received
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US Patent 12070875 Silicon carbide wafers with relaxed positive bow and related methods
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US Patent 11654596 Silicon carbide wafers with relaxed positive bow and related methods
0
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US Patent 11911842 Laser-assisted method for parting crystalline material
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Patent Inventor Names
Masayoshi Kumagai
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
RE45403
0
Patent Primary Examiner
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Samuel M. Heinrich
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