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Younes Boulghassoul
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Edits on 14 Dec, 2021
"Remove inverse infobox"
Golden AI
edited on 14 Dec, 2021
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-3
properties)
Infobox
Patent primary examiner of
US Patent 11183453 Electronic-component-embedded substrate having a wiring line with a roughened surface, electronic component device, and communication module
US Patent 11183503 Memory cell having top and bottom electrodes defining recesses
US Patent 11189710 Method of forming a bottom isolation dielectric by directional sputtering of a capping layer over a pair of stacks
Edits on 2 Dec, 2021
Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 11189710 Method of forming a bottom isolation dielectric by directional sputtering of a capping layer over a pair of stacks
Edits on 25 Nov, 2021
Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 11183503 Memory cell having top and bottom electrodes defining recesses
Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 11183453 Electronic-component-embedded substrate having a wiring line with a roughened surface, electronic component device, and communication module
"Created via: Entity Importer"
Golden AI
created this topic on 25 Nov, 2021
Edits made to:
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(
+2
properties)
Younes Boulghassoul
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United States Patent and Trademark Office
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