List of ASAT patents

Patents where

Current Assignee

Name

ASAT

Name	Description	Current Assignee	Patent Jurisdiction	Patent Number	Date of Patent
‌ US Patent 6987032 Ball grid array package and process for manufacturing same	Patent 6987032 was granted and assigned to ASAT on January, 2006 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	6987032	January 17, 2006
‌ US Patent 7381588 Shielded integrated circuit package	Patent 7381588 was granted and assigned to ASAT on June, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7381588	June 3, 2008
‌ US Patent 7315080 Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader	Patent 7315080 was granted and assigned to ASAT on January, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7315080	January 1, 2008
‌ US Patent 7482690 Electronic components such as thin array plastic packages and process for fabricating same	Patent 7482690 was granted and assigned to ASAT on January, 2009 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7482690	January 27, 2009
‌ US Patent 7091581 Integrated circuit package and process for fabricating the same	Patent 7091581 was granted and assigned to ASAT on August, 2006 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7091581	August 15, 2006
‌ US Patent 7358119 Thin array plastic package without die attach pad and process for fabricating the same	Patent 7358119 was granted and assigned to ASAT on April, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7358119	April 15, 2008
‌ US Patent 6982491 Sensor semiconductor package and method of manufacturing the same	Patent 6982491 was granted and assigned to ASAT on January, 2006 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	6982491	January 3, 2006
‌ US Patent 7348663 Integrated circuit package and method for fabricating same	Patent 7348663 was granted and assigned to ASAT on March, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7348663	March 25, 2008
‌ US Patent 6933176 Ball grid array package and process for manufacturing same	Patent 6933176 was granted and assigned to ASAT on August, 2005 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	6933176	August 23, 2005
‌ US Patent 7439099 Thin ball grid array package	Patent 7439099 was granted and assigned to ASAT on October, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7439099	October 21, 2008
‌ US Patent 7372151 Ball grid array package and process for manufacturing same	Patent 7372151 was granted and assigned to ASAT on May, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7372151	May 13, 2008
‌ US Patent 7271032 Leadless plastic chip carrier with etch back pad singulation	Patent 7271032 was granted and assigned to ASAT on September, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7271032	September 18, 2007
‌ US Patent 7371610 Process for fabricating an integrated circuit package with reduced mold warping	Patent 7371610 was granted and assigned to ASAT on May, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7371610	May 13, 2008
‌ US Patent 7270867 Leadless plastic chip carrier	Patent 7270867 was granted and assigned to ASAT on September, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7270867	September 18, 2007
‌ US Patent 7449771 Multiple leadframe laminated IC package	Patent 7449771 was granted and assigned to ASAT on November, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7449771	November 11, 2008
‌ US Patent 7226811 Process for fabricating a leadless plastic chip carrier	Patent 7226811 was granted and assigned to ASAT on June, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7226811	June 5, 2007
‌ US Patent 7247526 Process for fabricating an integrated circuit package	Patent 7247526 was granted and assigned to ASAT on July, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7247526	July 24, 2007
‌ US Patent 7410830 Leadless plastic chip carrier and method of fabricating same	Patent 7410830 was granted and assigned to ASAT on August, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7410830	August 12, 2008
‌ US Patent 7224048 Flip chip ball grid array package	Patent 7224048 was granted and assigned to ASAT on May, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7224048	May 29, 2007
‌ US Patent 7342305 Thermally enhanced cavity-down integrated circuit package	Patent 7342305 was granted and assigned to ASAT on March, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7342305	March 11, 2008
‌ US Patent 7411289 Integrated circuit package with partially exposed contact pads and process for fabricating the same	Patent 7411289 was granted and assigned to ASAT on August, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7411289	August 12, 2008
‌ US Patent 7344920 Integrated circuit package and method for fabricating same	Patent 7344920 was granted and assigned to ASAT on March, 2008 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7344920	March 18, 2008
‌ US Patent 7232755 Process for fabricating pad frame and integrated circuit package	Patent 7232755 was granted and assigned to ASAT on June, 2007 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	7232755	June 19, 2007
‌ US Patent 6946324 Process for fabricating a leadless plastic chip carrier	Patent 6946324 was granted and assigned to ASAT on September, 2005 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	6946324	September 20, 2005
‌ US Patent 6984785 Thermally enhanced cavity-down integrated circuit package	Patent 6984785 was granted and assigned to ASAT on January, 2006 by the United States Patent and Trademark Office.	ASAT	United States Patent and Trademark Office	6984785	January 10, 2006

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