Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 11, 2008
Patent Application Number
10681983
Date Filed
October 9, 2003
Patent Primary Examiner
Patent abstract
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
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