US Patent 7449771 Multiple leadframe laminated IC package
Patent 7449771 was granted and assigned to ASAT on November, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 9, 2003
Date of Patent
November 11, 2008
Patent Application Number
10681983
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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