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Eddie C. Lee
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Edits on 14 Dec, 2021
"Remove inverse infobox"
Golden AI
edited on 14 Dec, 2021
Edits made to:
Infobox
(
-15
properties)
Infobox
Patent primary examiner of
US Patent 7091582 Electronic package with snap-on perimeter wall
US Patent 7102209 Substrate for use in semiconductor manufacturing and method of making same
US Patent 7102230 Circuit carrier and fabrication method thereof
US Patent 7105917 Semiconductor device having a fuse connected to a pad and fabrication method thereof
US Patent 7109531 High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment
US Patent 7115997 Seedless wirebond pad plating
US Patent 7119372 Flip-chip light emitting diode
US Patent 7125744 High-frequency module and method for manufacturing the same
US Patent 7132743 Integrated circuit package substrate having a thin film capacitor structure
US Patent 7132755 Adhesive film for manufacturing semiconductor device
US Patent 7138706 Semiconductor device and method for manufacturing the same
US Patent 7154188 Semiconductor chip, semiconductor device, circuit board, and electronic instrument
US Patent 7170151 Accurate alignment of an LED assembly
US Patent 7170187 Low stress conductive polymer bump
US Patent 7173322 COF flexible printed wiring board and method of producing the wiring board
Edits on 22 Nov, 2021
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7173322 COF flexible printed wiring board and method of producing the wiring board
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7170187 Low stress conductive polymer bump
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7170151 Accurate alignment of an LED assembly
Edits on 19 Nov, 2021
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7154188 Semiconductor chip, semiconductor device, circuit board, and electronic instrument
Edits on 19 Nov, 2021
Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7138706 Semiconductor device and method for manufacturing the same
Edits on 18 Nov, 2021
Golden AI
edited on 18 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7132755 Adhesive film for manufacturing semiconductor device
Golden AI
edited on 18 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7132743 Integrated circuit package substrate having a thin film capacitor structure
Golden AI
edited on 18 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7125744 High-frequency module and method for manufacturing the same
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7119372 Flip-chip light emitting diode
Edits on 17 Nov, 2021
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7115997 Seedless wirebond pad plating
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7109531 High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7105917 Semiconductor device having a fuse connected to a pad and fabrication method thereof
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7102230 Circuit carrier and fabrication method thereof
Golden AI
edited on 17 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7102209 Substrate for use in semiconductor manufacturing and method of making same
Golden AI
edited on 16 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent primary examiner of
US Patent 7091582 Electronic package with snap-on perimeter wall
"Created via: Entity Importer"
Golden AI
created this topic on 16 Nov, 2021
Edits made to:
Infobox
(
+2
properties)
Eddie C. Lee
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Person
Current Employer
United States Patent and Trademark Office
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