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H01L 2924/15321

Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

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Edits on 5 Mar, 2022
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created this topic on 5 Mar, 2022
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 H01L 2924/15321

Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Infobox
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Patent classification
Classification Type
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Cooperative Patent Classification
Parent classification
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H01L 2924/1532
Website
http://data.epo.org/linked-data/def/cpc/H01L2924-15321

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