Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

H01L 2924/15321

Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

OverviewStructured DataIssuesContributorsActivity

Currently, there are no issues on this topic.

Find more entities like H01L 2924/15321

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo