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Hoa B Trinh

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Edits on 15 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-10 properties)
Infobox
Patent primary examiner of
‌
US Patent 7535096 Glass substrate and capacitance-type pressure sensor using the same
‌
US Patent 7573139 Packed system of semiconductor chips having a semiconductor interposer
‌
US Patent 7741170 Dielectric structure in nonvolatile memory device and method for fabricating the same
‌
US Patent 7745256 Rectangular-shaped controlled collapse chip connection
‌
US Patent 7745842 Graytone mask and method thereof
‌
US Patent 7745918 Package in package (PiP)
‌
US Patent 7745927 Heat sink formed of multiple metal layers on backside of integrated circuit die
‌
US Patent 7763537 Metal interconnection of semiconductor device and method for forming the same
‌
US Patent 7786496 Semiconductor device and method of manufacturing same
‌
US Patent 7982315 Semiconductor structure and method of making the same
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7982315 Semiconductor structure and method of making the same
Edits on 5 Dec, 2021
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Golden AI
edited on 5 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7786496 Semiconductor device and method of manufacturing same
Golden AI profile picture
Golden AI
edited on 5 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7763537 Metal interconnection of semiconductor device and method for forming the same
Edits on 4 Dec, 2021
Golden AI profile picture
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7745927 Heat sink formed of multiple metal layers on backside of integrated circuit die
Golden AI profile picture
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7745918 Package in package (PiP)
Golden AI profile picture
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7745842 Graytone mask and method thereof
Golden AI profile picture
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7745256 Rectangular-shaped controlled collapse chip connection
Golden AI profile picture
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7741170 Dielectric structure in nonvolatile memory device and method for fabricating the same
Edits on 2 Dec, 2021
Golden AI profile picture
Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7573139 Packed system of semiconductor chips having a semiconductor interposer
Golden AI profile picture
Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7535096 Glass substrate and capacitance-type pressure sensor using the same
"Created via: Entity Importer"
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Golden AI
created this topic on 2 Dec, 2021
Edits made to:
Infobox (+2 properties)
‌

 Hoa B Trinh

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Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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