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Peniel M Gumedzoe

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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edited on 14 Dec, 2021
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Patent primary examiner of
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US Patent 11171073 Switching semiconductor device and cooling apparatus thereof
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US Patent 11177174 Selective deposition of carbon films and uses thereof
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US Patent 11183460 Embedded die packaging with integrated ceramic substrate
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US Patent 11183666 Optoelectronic semiconductor component
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US Patent 11189534 Semiconductor assembly and deterioration detection method
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US Patent 11189541 Semiconductor package
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US Patent 11189575 Specialized surface mount device for symmetric heat distribution in package
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US Patent 11189596 Methods of forming multi-chip wafer level packages
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US Patent 11189699 Superlattice structure including two-dimensional material and device including the superlattice structure
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US Patent 7700392 Manufacturing method of semiconductor laser devices and manufacturing apparatus of the same
Edits on 4 Dec, 2021
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edited on 4 Dec, 2021
Edits on 2 Dec, 2021
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edited on 2 Dec, 2021
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189596 Methods of forming multi-chip wafer level packages
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189575 Specialized surface mount device for symmetric heat distribution in package
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189541 Semiconductor package
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Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11189534 Semiconductor assembly and deterioration detection method
Edits on 25 Nov, 2021
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11183666 Optoelectronic semiconductor component
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Golden AI
edited on 25 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11183460 Embedded die packaging with integrated ceramic substrate
Edits on 19 Nov, 2021
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Golden AI
edited on 19 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11177174 Selective deposition of carbon films and uses thereof
Edits on 11 Nov, 2021
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Golden AI
edited on 11 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 11171073 Switching semiconductor device and cooling apparatus thereof
"Created via: Entity Importer"
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created this topic on 11 Nov, 2021
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 Peniel M Gumedzoe

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Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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