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US Patent 10002831 Selective and non-selective barrier layer wet removal

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 20, 2017
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Date of Patent
June 19, 2018
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Patent Application Number
15654869
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Patent Citations Received
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US Patent 11990410 Top via interconnect having a line with a reduced bottom dimension
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US Patent 11244861 Method and structure for forming fully-aligned via
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US Patent 11315830 Metallic interconnect structures with wrap around capping layers
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US Patent 11404311 Metallic interconnect structures with wrap around capping layers
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US Patent 11476415 Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features
Patent Inventor Names
Hosadurga Shobha
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Benjamin D. Briggs
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Cornelius B. Peethala
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David L. Rath
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Elbert E. Huang
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Raghuveer R. Patlolla
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10002831
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Patent Primary Examiner
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Hsien-Ming Lee
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