Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 3, 2018
Patent Application Number
15477106
Date Filed
April 2, 2017
Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
A 3D semiconductor device, the device including: a first die including a first transistors layer and a first interconnection layer; and a second die overlaying the first die, the second die including a second transistors layer and a second interconnection layer, where the second die thickness is less than 2 microns, and where the first die is substantially larger than the second die.
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