Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Vincent Dicaprio0
Diego Tonini0
Giback Park0
Giorgio Cellere0
Han-Wen Chen0
Kyuil Cho0
Steven Verhaverbeke0
Date of Patent
December 6, 2022
0Patent Application Number
172278110
Date Filed
April 12, 2021
0Patent Citations
...
Patent Primary Examiner
The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.
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