US Patent 10015882 Modular semiconductor package

Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.