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US Patent 10026687 Metal interconnects for super (skip) via integration

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
February 20, 2017
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Date of Patent
July 17, 2018
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Patent Applicant
GlobalFoundries
GlobalFoundries
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Patent Application Number
15437100
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Patent Citations Received
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US Patent 11908791 Partial subtractive supervia enabling hyper-scaling
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US Patent 10586012 Semiconductor process modeling to enable skip via in place and route flow
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US Patent 10831973 Semiconductor process modeling to enable skip via in place and route flow
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US Patent 10936782 Semiconductor process modeling to enable skip via in place and route flow
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US Patent 11587848 Forming metal plug through a hole in a device including a resistance layer and contacting embedded conductive structures
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US Patent 11037822 Svia using a single damascene interconnect
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US Patent 11600519 Skip-via proximity interconnect
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US Patent 11646264 Semiconductor structure with super via and manufacturing method thereof
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US Patent 10485111 Via and skip via structures
Patent Inventor Names
Xunyuan Zhang
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Shao Beng Law
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James Jay McMahon
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Sean Xuan Lin
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10026687
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Patent Primary Examiner
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S. V. Clark
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