US Patent 10037892 Multi-chip structure and method of forming same

A device includes a redistribution layer over a molding compound layer, a first chip over the fan-out structure, wherein the first chip comprise a plurality of first through vias connected to the redistribution layer and a second chip over the first chip, the second chip being connected to the first chip through a plurality of bumps, wherein the first chip and the second chip are in the molding compound layer, and wherein a center line of the first chip is not vertically aligned with a center line of the second chip.