US Patent 10061170 Method of manufacturing electronic device

According to one embodiment, a method of manufacturing an electronic device, includes preparing a first substrate including a first basement and a first conductive layer, and a second substrate includes a second basement and a second conductive layer, opposing the first conductive layer and spaced from the first conductive layer, providing a protection layer on the second substrate, forming a first hole penetrating the second substrate by irradiating the second substrate with a laser beam in a position overlapping the protection layer, removing the protection layer and forming a connecting material electrically connecting the first conductive layer and the second conductive layer to each other via the first hole after removing the protection layer.