Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Yen Chiu0
Hsien-Wei Chen0
Date of Patent
September 4, 2018
0Patent Application Number
148715930
Date Filed
September 30, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a molding compound and a through via extending through the molding compound. A via connection is disposed over the through via and a cap is disposed over the via connection. A plurality of holes are formed in a section of the cap.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
