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US Patent 10068844 Integrated fan-out structure and method of forming

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Patent abstract

A semiconductor device includes a molding compound and a through via extending through the molding compound. A via connection is disposed over the through via and a cap is disposed over the via connection. A plurality of holes are formed in a section of the cap.

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Patent Citations Received
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US Patent 11784129 Semiconductor package and method of fabricating the same
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Patent Inventor Names
Hsien-Wei Chen0
Ming-Yen Chiu0
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Patent Citations Received
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US Patent 11342274 Semiconductor package
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US Patent 11342274 Semiconductor package
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US Patent 10629537 Conductive vias in semiconductor packages and methods of forming same
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US Patent 10586763 Semiconductor device and method of manufacture
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US Patent 10290584 Conductive vias in semiconductor packages and methods of forming same
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 US Patent 10068844 Integrated fan-out structure and method of forming

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10068844
Date of patent
September 4, 2018
Patent application number
14871593
Date Filed
September 30, 2015
Patent primary examiner
‌
Fernando L Toledo

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