US Patent 10074542 Substrate processing method and substrate processing apparatus
Patent 10074542 was granted and assigned to Tokyo Electron on September, 2018 by the United States Patent and Trademark Office.
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Patent abstract
There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.
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Patent Inventor Names
Akihiro Kubo0
Teruhiko Kodama0
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US Patent 10074542 Substrate processing method and substrate processing apparatus
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10074542
Date of patent
September 11, 2018
Patent application number
15267183
Date Filed
September 16, 2016
Patent primary examiner
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