Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zhiwei Gong0
Michael B. Vincent0
Scott M. Hayes0
Date of Patent
September 11, 2018
Patent Application Number
15604834
Date Filed
May 25, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.
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