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US Patent 10074614 EMI/RFI shielding for semiconductor device packages

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Patent abstract

An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.

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Patent Inventor Names
Michael B. Vincent0
Scott M. Hayes0
Zhiwei Gong0
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Patent Citations Received
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US Patent 11563267 Methods for electromagnetic shielding using an outer cobalt layer
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US Patent 11038267 Apparatus and methods for electromagnetic shielding using an outer cobalt layer
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US Patent 10991659 Substrate-less integrated components
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US Patent 10535611 Substrate-less integrated components
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 US Patent 10074614 EMI/RFI shielding for semiconductor device packages

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10074614
Date of patent
September 11, 2018
Patent application number
15604834
Date Filed
May 25, 2017
Patent primary examiner
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Vu A Vu

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