Described herein is a headphone earpiece cover for covering an earpiece of a headphone, the headphone earpiece including a first portion, second portion, and third portion. The headphone earpiece cover includes a first fabric configured to overlay the first portion of the earpiece, a second fabric configured to overlay the second portion of the earpiece, and a third fabric configured to overlay the third portion of the earpiece. The first fabric, second fabric, and third fabric are different from each other.