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US Patent 10100858 Wafer-to-wafer alignment method

Patent 10100858 was granted and assigned to California Institute of Technology on October, 2018 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
California Institute of Technology
California Institute of Technology
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Current Assignee
California Institute of Technology
California Institute of Technology
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
101008580
Patent Inventor Names
Theodore Reck0
Ken B. Cooper0
Risaku Toda0
Robert H. Lin0
Alejandro Peralta0
Bertrand Thomas0
Cecile Jung-Kubiak0
Choonsup Lee0
...
Date of Patent
October 16, 2018
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Patent Application Number
153377450
Date Filed
October 28, 2016
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Patent Citations Received
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US Patent D993755 Self-locking retainer pin
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US Patent 11333682 Silicon probe for millimeter-wave and terahertz measurement and characterization
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US Patent D889256 Cotter pin
Patent Primary Examiner
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Matthew P Travers
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Patent abstract

A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.

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