US Patent 10101659 Lithography method with surface modification layer
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Patent abstract
A lithography method is provided in accordance with some embodiments. The lithography method includes forming a surface modification layer on a substrate, the surface modification layer including a hydrophilic top surface; coating a photoresist layer on the surface modification layer; and developing the photoresist layer, thereby forming a patterned photoresist layer.
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Patent Inventor Names
Hung-Chang Hsieh0
Hung-Chung Chien0
Lin-Hung Shiu0
Shu-Fang Chen0
Edits on 27 Mar, 2023
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Patent Jurisdiction
Patent Number
101016590
Date of Patent
October 16, 2018
0Patent Application Number
153553590
Date Filed
November 18, 2016
0Patent Primary Examiner
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US Patent 10101659 Lithography method with surface modification layer
Infobox
Is a
Patent jurisdiction
Patent number
10101659
Date of patent
October 16, 2018
Patent application number
15355359
Date Filed
November 18, 2016
Patent primary examiner
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