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US Patent 10103069 Pressure-activated electrical interconnection by micro-transfer printing

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 17, 2017
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Date of Patent
October 16, 2018
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Patent Application Number
15461703
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Patent Citations Received
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US Patent 12074583 Printing components to adhesive substrate posts
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US Patent 11884537 Enclosed cavity structures
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US Patent 11916179 Structures and methods for electrically connecting printed horizontal components
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US Patent 11950375 Printing components to substrate posts
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US Patent 11981559 Enclosed cavity structures
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US Patent 11482979 Printing components over substrate post edges
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US Patent 10332868 Stacked pixel structures
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US Patent 10451257 Micro-light-emitting diode backlight system
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US Patent 10468363 Chiplets with connection posts
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US Patent 10468391 Inorganic light-emitting-diode displays with multi-ILED pixels
•••
Patent Inventor Names
Carl Ray Prevatte, Jr.
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Christopher Andrew Bower
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Matthew Meitl
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Ronald S. Cok
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10103069
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Patent Primary Examiner
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Yosef Gebreyesus
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