Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 16, 2018
Patent Application Number
15433721
Date Filed
February 15, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device and method of manufacture is provided. A reflowable material is placed in electrical connection with a through via, wherein the through via extends through an encapsulant. A protective layer is formed over the reflowable material. In an embodiment an opening is formed within the protective layer to expose the reflowable material. In another embodiment the protective layer is formed such that the reflowable material is extending away from the protective layer.
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