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US Patent 10103132 Semiconductor device and method of manufactures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 15, 2017
Date of Patent
October 16, 2018
Patent Application Number
15433721
Patent Citations Received
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US Patent 11854955 Fan-out package with controllable standoff
0
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US Patent 11075151 Fan-out package with controllable standoff
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US Patent 11756802 Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device
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US Patent 11488843 Underfill between a first package and a second package
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US Patent 10658287 Semiconductor device having a tapered protruding pillar portion
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US Patent 10763132 Release film as isolation film in package
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10103132
Patent Primary Examiner
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Thinh T Nguyen

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