Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 23, 2018
Patent Application Number
15395057
Date Filed
December 30, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.
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