Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kent E. Regnier0
Date of Patent
November 6, 2018
0Patent Application Number
158819850
Date Filed
January 29, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.