Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kent E. Regnier0
Date of Patent
September 3, 2019
0Patent Application Number
161791630
Date Filed
November 2, 2018
0Patent Citations
Patent Primary Examiner
Patent abstract
A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
