US Patent 10403993 Connector system with thermal surface
Patent 10403993 was granted and assigned to Molex on September, 2019 by the United States Patent and Trademark Office.
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Patent abstract
A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.
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Patent Inventor Names
Kent E. Regnier0
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Official Website
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Patent Number
104039930
Date of Patent
September 3, 2019
0Patent Application Number
161791630
Date Filed
November 2, 2018
0Official Website
Patent Citations
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US Patent 10403993 Connector system with thermal surface
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10403993
Date of patent
September 3, 2019
Patent application number
16179163
Date Filed
November 2, 2018
Patent citations
Patent primary examiner
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