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US Patent 10131984 Substrate processing apparatus

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 13, 2013
Date of Patent
November 20, 2018
Patent Applicant
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Hitachi Kokusai Electric Inc.
Patent Application Number
13965242
Patent Citations Received
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US Patent 12123091 Substrate processing apparatus and method of manufacturing semiconductor device
0
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US Patent 11377737 Manifolds for uniform vapor deposition
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US Patent 11830731 Semiconductor deposition reactor manifolds
0
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US Patent 11492701 Reactor manifolds
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US Patent 11512392 Substrate processing apparatus
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US Patent 10508336 Substrate processing apparatus
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US Patent 10529605 Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
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US Patent 11014866 Synthesis and use of precursors for vapor deposition of tungsten containing thin films
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US Patent 11047042 Synthesis and use of precursors for ALD of molybdenum or tungsten containing thin films
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US Patent 11624112 Synthesis and use of precursors for ALD of molybdenum or tungsten containing thin films
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10131984
Patent Primary Examiner
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Karla A Moore

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