Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 20, 2018
Patent Application Number
15280462
Date Filed
September 29, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A wafer level package device and method are disclosed that include a warpage compensation metal adhered to a backside of a semiconductor wafer for minimizing warpage of the semiconductor wafer, where multiple metal features have been formed on the device side of the semiconductor substrate. The warpage compensation metal may include a copper film.
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