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US Patent 10139564 Vertically integrated optoelectronics package for MEMS devices

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
January 28, 2016
Date of Patent
November 27, 2018
Patent Application Number
15009153
Patent Citations Received
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US Patent 11408912 Feedthrough rejection for optomechanical devices
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US Patent 10833648 Acoustic management in integrated circuit using phononic bandgap structure
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US Patent 10886187 Thermal management in integrated circuit using phononic bandgap structure
0
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US Patent 10956768 Feedback cooling and detection for optomechanical devices
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US Patent 11372019 Optomechanical resonator stabilization for optomechanical devices
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US Patent 11408911 Optomechanical structure with corrugated edge
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US Patent 10371891 Integrated circuit with dielectric waveguide connector using photonic bandgap structure
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US Patent 10444432 Galvanic signal path isolation in an encapsulated package using a photonic structure
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US Patent 10497651 Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
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US Patent 10553573 Self-assembly of semiconductor die onto a leadframe using magnetic fields
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•••
Patent Inventor Names
Matt Eichenfield
0
Brian D. Homeijer
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10139564
Patent Primary Examiner
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Georgia Y Epps

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