Patent 10141228 was granted and assigned to United Microelectronics Corporation on November, 2018 by the United States Patent and Trademark Office.
A semiconductor device includes: a fin-shaped structure on a substrate; a single diffusion break (SDB) structure in the fin-shaped structure to divide the fin-shaped structure into a first portion and a second portion; a gate structure on the first portion; and a contact etch stop layer (CESL) adjacent to the gate structure and extending to cover the SDB structure.