US Patent 10147666 Lateral cooling for multi-chip packages
Patent 10147666 was granted and assigned to Xilinx on December, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 31, 2014
0
Date of Patent
December 4, 2018
0
Patent Applicant
Patent Application Number
14449052
0
Patent Citations Received
Patent Inventor Names
Austin H. Lesea
0
Stephen M. Trimberger
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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