Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Martin Voogel0
Praful Jain0
Brian Gaide0
Date of Patent
June 22, 2021
0Patent Application Number
164374980
Date Filed
June 11, 2019
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.
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