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US Patent 11043480 Forming and/or configuring stacked dies

Patent 11043480 was granted and assigned to Xilinx on June, 2021 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Xilinx
Xilinx
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Date Filed
June 11, 2019
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Date of Patent
June 22, 2021
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Patent Applicant
Xilinx
Xilinx
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Patent Application Number
16437498
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Patent Citations
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US Patent 10224310 Hybrid three-dimensional integrated circuit reconfigurable thermal aware and dynamic power gating interconnect architecture
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US Patent 10147666 Lateral cooling for multi-chip packages
Patent Citations Received
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US Patent 11961823 Forming and/or configuring stacked dies
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US Patent 11762440 Systems and methods for reconfiguring dual-function cell arrays
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US Patent 11402886 Systems and methods for reconfiguring dual-function cell arrays
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US Patent 11435800 Systems and methods for reconfiguring dual-function cell arrays
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US Patent 11895191 Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem
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US Patent 11463524 Mobile IoT edge device using 3D-die stacking re-configurable processor module with 5G processor-independent modem
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Patent Inventor Names
Martin Voogel
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Praful Jain
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Brian Gaide
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11043480
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Patent Primary Examiner
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Zandra V. Smith
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