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US Patent 10157871 Integrated fan-out package and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 12, 2017
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Date of Patent
December 18, 2018
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Patent Application Number
15730760
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Patent Citations Received
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US Patent 12094828 Eccentric via structures for stress reduction
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US Patent 11670601 Stacking via structures for stress reduction
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US Patent 11749644 Semiconductor device with curved conductive lines and method of forming the same
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US Patent 11855008 Stacking via structures for stress reduction
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US Patent 12021002 Warpage control of semiconductor die
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Patent Inventor Names
Yu-Min Liang
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Chin-Liang Chen
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Hai-Ming Chen
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Kuan-Lin Ho
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Chi-Yang Yu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10157871
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Patent Primary Examiner
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Selim Ahmed
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