US Patent 10157894 Semiconductor device having stacked chips
Patent 10157894 was granted and assigned to Toshiba Memory Corporation on December, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 21, 2017
0
Date of Patent
December 18, 2018
0
Patent Applicant
Patent Application Number
15819468
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Patent Citations Received
Patent Inventor Names
Masaru Koyanagi
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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