Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chin-Liang Chen0
Hsin-Yu Pan0
Kuan-Lin Ho0
Sheng-Hsiang Chiu0
Yu-Chih Liu0
Date of Patent
December 25, 2018
0Patent Application Number
141406920
Date Filed
December 26, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened.
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