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Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shin-Puu Jeng0
Shu-Shen Yeh0
Chia-Kuei Hsu0
Po-Yao Lin0
Chin-Hua Wang0
Date of Patent
April 30, 2024
0Patent Application Number
183128770
Date Filed
May 5, 2023
0Patent Citations
...
Patent Primary Examiner
Patent abstract
Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.
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