Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pei-Ching Kuo0
Jun-Lin Yeh0
Ku-Feng Yang0
Li-Han Hsu0
Wei-Cheng Wu0
Wen-Chih Chiou0
Yi-Hsiu Chen0
Yung-Chi Lin0
Date of Patent
August 23, 2016
Patent Application Number
14289819
Date Filed
May 29, 2014
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Apparatus, and methods of manufacture thereof, in which metal is deposited into openings, thus forming a plurality of metal pads, a plurality of through-silicon-vias (TSVs), a plurality of metal lines, a plurality of first dummy structures, and a plurality of second dummy structures. Ones of the plurality of first dummy structures each have a first width that is at least about three times greater than a second width of each of the plurality of metal lines, and ones of the plurality of second dummy structures each have a third width that is at least about five times greater than the second width of each of the plurality of metal lines.
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