Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Pin Hu0
Shin-Puu Jeng0
Tzu-Wei Chiu0
Cheng-Hsien Hsieh0
Kuo-Ching Hsu0
Shang-Yun Hou0
Date of Patent
March 29, 2016
0Patent Application Number
137633350
Date Filed
February 8, 2013
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a semiconductor device comprising an interconnecting structure consisting of a plurality of thin film layers and a plurality of metal layers disposed therein, each of the plurality of metal layers having substantially a same top surface area, and a die comprising an active surface and a backside surface opposite the active surface, the active surface being directly coupled to a first side of the interconnecting structure. The semiconductor device further comprises a first connector directly coupled to a second side of the interconnecting structure, the second side being opposite the first side.
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