Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Fa Chen0
Chao-Wen Shih0
Sung-Feng Yeh0
Date of Patent
October 22, 2024
0Patent Application Number
178839990
Date Filed
August 9, 2022
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A package structure and method of manufacturing is provided, whereby a bonding dielectric material layer is provided at a back side of a wafer, a bonding dielectric material layer is provided at a front side of an adjoining wafer, and wherein the bonding dielectric material layers are fusion bonded to each other.
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