Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tang-Jung Chiu0
Chi-Hsi Wu0
Hsiang-Fan Lee0
Shih-Peng Tai0
Wen-Chih Chiou0
Chen-Hua Yu0
Date of Patent
March 8, 2016
0Patent Application Number
142987110
Date Filed
June 6, 2014
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A method for forming integrated circuit packages is presented. A first plurality of first tier stacks are mounted to the substrate, wherein the substrate has one or more contact pads corresponding to each of the first tier stacks and has one or more probing pads associated with each of the first tier stacks. Each of the first tier stacks is electrically tested to identify known good first tier stacks and known bad first tier stacks. A first plurality of stacking substrates are mounted to the known good first tier stacks, thereby forming a plurality of second tier stacks. Each of the second tier stacks is electrically tested to identify known good second tier stacks and known bad second tier stacks.
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