Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 4, 2016
Patent Application Number
14690061
Date Filed
April 17, 2015
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
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