Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Se Young Yang0
Chonghua Zhong0
Jun Zhai0
Kunzhong Hu0
Date of Patent
January 15, 2019
0Patent Application Number
154082630
Date Filed
January 17, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Package on package structures and methods of manufacture are described. In various embodiments, DRAM die are integrated into various locations within a package on package structure, including within a bottom logic die package, as a co-package with a top NAND die package, and as a hybrid package structure between a top NAND die package and a bottom logic die package.
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